Low Formaldehyde Emission Adhesive
The majority of the non-structural composite wood industry uses urea formaldehyde based adhesive resins. Formaldehyde-based resins are of concern due to the toxicity and carcinogenicity associated with formaldehyde emissions. This technology consists in a method of obtaining a low formaldehyde emission adhesive, to which additives of copper nanoparticles, nanocellulose or nanofibrillated cellulose are added, allowing to increase the rigidity and internal cohesion of the adhesive or resin and In turn, shorten the setting times of the adhesive mixture, improving the physical and mechanical properties of the wooden elements.
CURRENT STATE OF THE TECHNOLOGY
Tests have been carried out at laboratory level, obtaining adhesive products that have shown the increase of 25% the properties of the composite materials based on wood in which it has been used, despite having strongly reduced the presence of formaldehyde in the product or resin.
The majority of the non-structural composite wood industry uses urea formaldehyde- based adhesive resins. The industry is in constant search for inexpensive additives with lower emissions below the new CARB II/EPA (California Air Resources Board/Environmental Protection Agency) standards and maintaining the quality of the end product. The trend in the industry is to replace current urea formaldehyde-based resins with formaldehyde-free resins. The market is led by Asia Pacific, in particular China and India.
Acceleration of internal bonding produced by the novel additives results in:
Faster manufacturing speed
Lower manufacturing temperature
Less required resin volume
Increased strength and durability
Lower formaldehyde emissions (below CARB II standard of 0.21 mg/m3)
Overall lower cost and Higher quality
In addition: the fungal properties make it resistant to termites
Oscar Astudillo, Technology Transfer Coordinator
+56 22 389 5603